发明名称 ELECTROLESS-PLATED ELECTROCONDUCTIVE POWDER AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide an electroless-plated electroconductive powder having high electroconductivity, corrosion resistance, high reliability and superior dispersibility, and to provide a manufacturing method therefor. SOLUTION: The electroless-plated electroconductive powder has an electroless-plated layer of gold directly formed on the surface of a core material particle made of copper, and uniformly covering the whole area of the particle of the core material. The method for manufacturing the plated powder comprises charging the core material particles into an aqueous solution including a complexing agent, dispersing the particles, and adding gold ions to the obtained dispersion liquid to displacement-deposits them to directly form the plating layer on the surface of the core material particles. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004323962(A) 申请公布日期 2004.11.18
申请号 JP20030124442 申请日期 2003.04.28
申请人 NIPPON CHEM IND CO LTD 发明人 ABE SHINJI;OYAMADA MASAAKI
分类号 B22F1/00;B22F1/02;C23C18/42;H01B1/00;H01B1/22;(IPC1-7):B22F1/00 主分类号 B22F1/00
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