| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate obtained by positioning and fixing a plurality of substrates with improved positional precision, and to provide a multilayer wiring board. SOLUTION: The substrates form a circuit, and an insulating resin component is arranged around a part or the whole of the circuit. The multilayer substrate obtained by positioning and fixing the plurality of substrates in the thickness direction of the substrates by using a heat source is provided, and the multilayer wiring board using this is provided. COPYRIGHT: (C)2005,JPO&NCIPI |
