| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing equipment in which chemical can be ejected with high accuracy without increasing the burden on an operator. SOLUTION: The substrate processing equipment performing processing with chemical is provided with a nozzle 12 for ejecting chemical, chemical piping 13 for introducing chemical to the nozzle 12, a resist pump 14 for feeding chemical to the nozzle 12, a valve 15 for opening/closing the chemical piping 13 through a motor, a pressure sensor 19 for detecting the pressure in the chemical piping 13, and a control section 20. The control section 20 compares the output (pressure waveform) from the pressure sensor 19 during coating process of a substrate 90 with the output (reference pressure waveform) from the pressure sensor 19 when good processing results are attained and alters control parameters such that they will match each other thus feedback controlling the open/close valve 15. COPYRIGHT: (C)2005,JPO&NCIPI |
