| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for mounting a semiconductor element, superior in reliability in electrical connection via solder balls between wiring conductors of an insulating base and circuit wirings of an external electric circuit board. SOLUTION: A plurality of solder balls 3, 3a are arranged in a square shape in all directions on the other main surface of the insulating base 1 on the board 4 for mounting the semiconductor element with melting points of the solder balls 3a formed at each corner of the square shape arrangement which is higher than those of the other solder balls 3, and with diameters of the solder balls 3a being smaller than those of the other solder balls 3. COPYRIGHT: (C)2005,JPO&NCIPI
|
