| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable ceramic circuit board and an electrical circuit module, having a simple structure and superior heat dissipation performance, where its ceramic board will not be damaged, even if subjected to heat cycle between high and low temperatures. SOLUTION: Ceramic boards 33 are bonded to both the surfaces of a metal circuit plate 31, a concave part 37 is formed in the ceramic board 33a so that the metal circuit plate 31 is exposed, and an electrical device 35 is mounted on the metal circuit plate 31 exposed to the concave part 37. COPYRIGHT: (C)2005,JPO&NCIPI
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