| 摘要 |
PROBLEM TO BE SOLVED: To provide thin film deposition equipment which can surely deposit a thin film having a specified uniform thickness on a substrate surface of a semiconductor substrate or the like. SOLUTION: In the thin film deposition equipment, predetermined gas G is blown in a chamber 1 from a plurality of nozzles 6 arranged in an inner upper par of a chamber 1, and a specified thin film is deposited on a substrate 5 arranged in the chamber 1. Each of the nozzle 6 is provided with a nozzle 11 for gas blowdown and a massflow controller 13 for controlling the amount of gas supply to the nozzle 11 in the upstream of the nozzle 11. From each of the nozzle 6, predetermined gas G is made to blow out uniformly. COPYRIGHT: (C)2005,JPO&NCIPI
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