| 发明名称 |
METHOD OF REMOVING EDGE PORTION OF LAYER APPLIED TO SUBSTRATE AND DEVICE, METHOD OF COATING SUBSTRATE AND DEVICE, AND SUBSTRATE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of removing edge portion of a layer treated on a substrate used in a micro lithography processing treatment. <P>SOLUTION: The edge portion is removed in evaporation by a laser beam in such a way that the laser beam is focused on the edge portion of a treating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2004327973(A) |
申请公布日期 |
2004.11.18 |
| 申请号 |
JP20040106382 |
申请日期 |
2004.03.31 |
| 申请人 |
SCHOTT GLAS |
发明人 |
WAGNER HERMANN;BEIER BERND;SCHIFFLER MARIO;HESS GUENTER;RUDAKOFF PETER;HOETZEL BERND |
| 分类号 |
B23K26/40;G03F7/20;H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
B23K26/40 |
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