| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip desiccant produced by utilizing the existing desiccant producing equipment and preventing the occurrence of failure of powderization, excessive drying or the like. <P>SOLUTION: The chip desiccant is packaged by packaging material and is made by dispersing calcium oxide powder to plastics. Therein, the weight ratio of calcium oxide to plastics is 60/40-90/10, the average particle size of calcium oxide is≤30μm, the weight ratio of calcium oxide having particle size≥75μm is≤20 wt.%, the elongation to break of the plastics is≥200%, the major axis diameter of the chip is 0.5-5.0 mm, the minor axis diameter and the thickness thereof are 0.5-2.5 mm respectively and the water vapor permeability of the packaging material is≥25 g/m<SP>2</SP>×24hr (at 25°C, 0-90% RH). <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
