SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device that can be realized without increasing the chip size by preventing the deterioration of the circuit characteristics of an analog circuit disposed on a semiconductor substrate (semiconductor chip), even when a channel potential transiently becomes lower than a ground potential or higher than a power-supply potential due to the feed through current of a digital circuit disposed on the same semiconductor substrate (semiconductor chip) as that of the analog circuit section; and to provide a CCD camera provided with the integrated circuit device. SOLUTION: The semiconductor integrated circuit device is provided with the digital circuit 2 and analog circuit 3 formed on the surface of the same semiconductor substrate 1 and a dummy polysilicon layer 4 constituting the gate of a transistor between the circuits 2 and 3. COPYRIGHT: (C)2005,JPO&NCIPI