| 摘要 |
PROBLEM TO BE SOLVED: To solve the disadvantage that, since the fine movement of a wafer stage is carried out under an overdriven condition, a large load is applied to a wafer, and in particular, in a product having a solder bump mounted on a pad, since the bump is crushed, which leads to reduction in the product yield. SOLUTION: A probe device has a mechanism in which the tip of a needle of a probe card is brought into contact with the wafer mounted on the wafer stage and an overdrive is applied based on the position of a contact between the probe needle and the wafer. The overdrive is gradually applied to the wafer stage to finely move it. Thereby the value of the contact resistance can also be reduced while reducing the load applied to the wafer, and a product yield can advantageously be increased. COPYRIGHT: (C)2005,JPO&NCIPI
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