发明名称 SUBSTRATE PROCESSOR
摘要 PROBLEM TO BE SOLVED: To provide a substrate processor wherein the processing time of a substrate can be shortened without using any expensive asher apparatus by contacting uniformly the bubbles of an ozone gas with the substrate. SOLUTION: Since a bubble feeding means 33 so has bubble generating components that bubbles overlap partly with each other in the direction of the surface of a substrate W, there can be eliminated any portion in the direction of the surface of the substrate W wherewith no bubble of an ozone gas is contacted, and the bubbles of the ozone gas can be contacted uniformly with the substrate W in the direction of its surface. Therefore, the processing time of the substrate W can be shortened without using any expensive asher apparatus. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004327826(A) 申请公布日期 2004.11.18
申请号 JP20030122266 申请日期 2003.04.25
申请人 TOSHIBA CORP;DAINIPPON SCREEN MFG CO LTD 发明人 TOMITA HIROSHI;NADAHARA SOICHI;OGUCHI HISASHI;MURAOKA YUSUKE;MIYAKE TAKASHI;OJIMARU TOMONORI
分类号 H01L21/306;B08B3/04;B08B3/10;H01L21/00;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/306
代理机构 代理人
主权项
地址