发明名称 THERMOPLASTIC RESIN COMPOSITION, FILM AND MATERIAL FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition suitable for obtaining a formed article having a low water absorbency (moisture absorbency) and exhibiting excellent dimensional stability even under a high temperature and high humidity, and a film and a material for a substrate plate by using the thermoplastic resin composition. SOLUTION: This thermoplastic resin composition containing 100 pts. wt. thermoplastic resin and 0.5-45 pts. wt. phyllosilicate salt organized with a specific organic onium ion has≥150°C glass transition temperature and≥42.0 (J/cm<SP>3</SP>)<SP>1/2</SP>solubility parameter. The thermoplastic resin is at least 1 kind selected from a group consisting of a polyimide resin, polyesterimide resin, polyetherimide resin and polyetheretherketone resin, and the stratified silicate salt is at least 1 kind selected from a group consisting of montmorillonite, hectorite, swelling mica and vermiculite. The film and material for substrate plate produced by using the thermoplastic resin composition are also provided. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004323797(A) 申请公布日期 2004.11.18
申请号 JP20030124332 申请日期 2003.04.28
申请人 SEKISUI CHEM CO LTD 发明人 FUJIWARA AKIHIKO;DEGUCHI HIDEHIRO
分类号 C08L101/00;C08K9/04;(IPC1-7):C08L101/00 主分类号 C08L101/00
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