| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic cleaning method capable of obtaining a sufficient cleaning effect in short processing time at a high yield for an object to be cleaned such as a hard disk and a semiconductor wafer in a planar shape provided with a through-hole passing through to the front and back. SOLUTION: In the cleaning method, the plurality of objects 1 to be cleaned in the planar shape provided with the through-hole 16 passing through to the front and back are horizontally suspended with a space at upper and lower parts so as to align the through-holes 16 in a vertical direction inside a cleaning tank 4 filled with a medium 3, a bar-shaped ultrasonic wave emitting body 9 implanted from an ultrasonic vibrator 8 positioned outside the tank is inserted into the through-holes 16 and ultrasonic waves are applied from the inside of the through-holes 16 to the objects 1 to be cleaned by the ultrasonic wave emitting body 9. COPYRIGHT: (C)2005,JPO&NCIPI
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