| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a polyimide film having excellent storage stability, pattern forming property with high resolution, and excellent physical properties such as strength and heat resistance. <P>SOLUTION: The positive photosensitive resin composition contains the following polyimide (a) and a photosensitive agent (b). The polyimide (a) is prepared from a diamine component expressed by general formula (I) and general formula (II) and from an acid dianhydride component expressed by general formula (III), and the polyimide has amide couplings having unclosed rings by 0.1 to 30% in the whole condensation linking groups. In formula (I), R<SB>1</SB>represents a divalent aromatic group. In formula (II), R<SB>2</SB>represents a divalent aromatic group having at least one sulfonic acid group or more. In formula (III), Z represents a tetravalent group selected from a group consisting of monocyclic aromatic groups, condensed polycyclic aromatic groups and non-condensed polycyclic aromatic groups having aromatic groups mutually and directly linked or linked via crosslinking members. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
