| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card and its manufacturing method for maintaining an excellent card surface quality by suppressing deformations of reinforcing plates constituting an IC module. <P>SOLUTION: In an IC module 11 with a structure in which an IC chip 14 on an antenna substrate 19 is held between a pair of reinforcing plates 16, 18 via sealing resins 15, 17, the difference in the layer thickness of the resin 15 around the IC chip 14 is reduced by disposing a spacer 28 surrounding around the IC chip 14 between the reinforcing plate 16 and the antenna substrate 19, thereby the progress of a curing reaction of the sealing resin 15 is made uniform, the occurrence of dimensional variations of thermal shrinkage is suppressed and the deformations of the reinforcing plates are suppressed. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
