| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring circuit board which can increase quality and a manufacturing efficiency and realize thin and high-integration semiconductor circuit device by solving various problems in manufacturing steps, and also a method for manufacturing a semiconductor integrated circuit device using the wiring circuit board. <P>SOLUTION: In the method for manufacturing a wiring circuit board, a multilayered metallic board having a metallic layer 2 for bump formation, a metallic layer 4 for wiring film formation, and an etching stop layer 3 disposed therebetween is used. The method for manufacturing a semiconductor integrated circuit device using the wiring circuit board includes a step of selectively etching the metallic layer 2 for bump formation to form an opening 2a and more specifically, a step of forming a plurality of stack terminal bumps 8, a semiconductor chip mount region surrounded by the plurality of stack terminal bumps 8, and a stiffener 9 surrounding the outer periphery of the plurality of stack terminal bumps 8. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
