| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for which it is not required to lay around external wiring on a mounting substrate. SOLUTION: This semiconductor device comprises an insulating thin film having a first recessed section on its first side face, internal wiring which is provided on the surface of the thin film and one wiring end of which is disposed in the first recessed section, and a semiconductor chip which is faced to the surface of the thin film and electrically connected to the internal wiring. This device also comprises an insulating board which is disposed around the semiconductor chip to face the surface of the thin film and has a top surface at the same height as that of the top surface of the semiconductor chip and a second recessed section on its second side face; and conductors which are provided in the first and second recessed sections, electrically connected to the internal wiring in a state where the conductors are protruded from the first and second side faces, and brought into contact with the wiring end. COPYRIGHT: (C)2005,JPO&NCIPI
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