ELECTRONIC PACKAGE WITH STRENGTHENED CONDUCTIVE PAD AND INFORMATION PROCESSING UNIT USING IT

摘要

PROBLEM TO BE SOLVED: To avoid cracking or separation in a circuit pattern (such as a pad) positioned on the surface of the circuit substrate of a package. SOLUTION: A package substrate 11' has a size sufficiently large enough to prevent detachment of an external conductive pad 13' even when the external conductive pad 13' is subject to a tensile pressure of approximately 1.4 grams per square mil or greater, and is equipped with an internal conductive layer 15" which is physically coupled to the external conductive pad 13'. COPYRIGHT: (C)2005,JPO&NCIPI