| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered circuit board(mother board, semiconductor chip loading substrate), a semiconductor package and a method of manufacturing them capable of securing the bonding strength of an inter-layer insulating layer and wiring, and capable of efficiently transmitting a high speed electric signal without forming any projection/recession beyond 1μm on the surface of wiring. SOLUTION: This multilayered wiring board is configured by forming a plurality of inter-layer insulating layers and wiring on one face or both faces of a core substrate, and a multilayered circuit board is configured by forming an insulating film containing aliphatic series thiol on the surface of wiring. Thus, it is possible to prevent any fine inter-wiring ion migration, and to manufacture the multilayered circuit board and the semiconductor package whose insulation reliability is high. COPYRIGHT: (C)2005,JPO&NCIPI |
