| 摘要 |
PROBLEM TO BE SOLVED: To provide an easily-manufacturable semiconductor sensor capable of mitigating a stress acting on the sensor, and having a simplified structure, and its manufacturing method. SOLUTION: This sensor has a groove part 4 provided on the back 2a side of a semiconductor substrate corresponding to the position where a diaphragm part formed to have a thin-walled shape on the semiconductor substrate, which is bendable and deformable corresponding to an applied force, is formed. The groove part 4 has a constitution wherein an expansion tilt part 5a having the side face tilted and expanded gradually from the back 2a side of the semiconductor substrate toward the surface 2b side, and a contraction tilt part 5b tilted and contracted gradually from the back 2a of the semiconductor substrate toward the surface 2b side in connection with the expansion tilt part 5a are formed, and an angular part 5c is formed on a portion where the tilt direction between the expansion tilt part 5a and the contraction tilt part 5b is changed. COPYRIGHT: (C)2005,JPO&NCIPI
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