| 摘要 |
An electronic device having: a substrate having an interconnecting pattern; a first chip component which has a first electrode and is mounted on a first surface of the substrate; a second chip component which has a second electrode and is mounted on a second surface of the substrate; a first insulating portion which is formed of resin and disposed adjacent to the first chip component; a second insulating portion which is formed of resin and disposed adjacent to the second chip component; a first interconnecting line formed to extend from over the first electrode, passing over the first insulating portion, to reach over the interconnecting pattern; and a second interconnecting line formed to extend from over the second electrode, passing over the second insulating portion, to reach over the interconnecting pattern.
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