Surface mount resistors as heat transfer augmentation devices

摘要

The present invention provides a heat transfer augmentation method and device for use on a printed circuit board. The inventive device comprises one or more elements having high impedance that are attached to traces on a printed circuit board, thus permitting heat transfer without allowing the device to affect the electrical circuit on the board. The elements can be surface mount resistors that conduct heat more efficiently than does the printed circuit board insulator material, such as resistors having alumina or aluminum nitride substrates. The inventive device and method is thus compatible with standard printed circuit board assembly procedures, is inexpensive, and has a smaller foot print on the circuit board than prior art heat transfer augmentation devices.