| 摘要 |
Two independent fine adjustment stages (62, 72) are arranged on one coarse adjustment stage (73) to simultaneously perform all of focus measurement and part of alignment measurement in parallel with exposure operation. A method of transporting a wafer together with a chuck is adopted as a precondition. Alignment of a pattern on a wafer (60) with a chuck (61) is performed before the chuck is mounted on each fine adjustment stage.
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