ADAPTIVE, FEEDBACK-CONTROLLED MATERIAL PROCESSING USING ULTRA-SHORT LASER PULSES

摘要

The invention relates to material processing using laser pulses and to a method and device for the microstructured, ablative processing of material (22), said processing being achieved in one or more sequential process steps by individual laser pulses. (14). According to the invention, ultra-short laser pulses are shaped in a precise manner with the aid of a phase modulator (12), the material (22) is irradiated with said pulses and the quality of the working process that results from the irradiation is recorded and evaluated using computer technology (32). This can, for example, be carried out with the aid of a signal emitted by laser-induced breakdown spectroscopy (LIBS). Said evaluation signal is evaluated by an optimisation algorithm and the information thus obtained is used immediately to calculate additional, potentially more suitable laser pulse forms, which are in turn set by the computer-controlled (34, 36) phase modulator (12). The material (22) is irradiated again with said new laser pulses (14), in such a way that the same conditions prevail on the material (22) as during the preceding pulse. The iteration is continued until an optimum efficiency is reached for the processing of the material.