| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad and a polishing apparatus, capable of less providing scratches to the surface of a substrate which is a member to be polished, and the polishing state during polishing can be measured optically and measured. <P>SOLUTION: In the polishing pad, wherein a light transmitting window member is provided to an opening formed to part of a polishing layer 1, the light transmitting window member is provided to a member 7 deformable more easily than the polishing layer and a cushion layer 5 provided, as required; distortion amount of indentation, caused when a prescribed pressure is applied to an upper face of the light transmitting window member, is greater than the distortion amount due to indentation caused, when a pressure the same amount as the prescribed pressure is applied to a region with the area of the upper side of the polishing layer being the same as the area of the light transmitting window member, to which the pressure is applied; and a sealing member 18 to prevent passage of liquid is used for at least part on the member deformable more easily than the polishing layer and the cushion layer provided, as required. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
