| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device exhibiting high reliability, e.g. soldering resistance, and excellent heat dissipation properties. <P>SOLUTION: The semiconductor device is formed by face down mounting a semiconductor element 2 on an interposer 1 and flip-chip bonding the semiconductor element 2. A metal plate 4 having an area larger than that of the surface of the semiconductor element 2 on the side opposite to the flip-chip joint is bonded to that surface. A gap at the flip-chip joint of the semiconductor element 2, the surface of the semiconductor element 2 other than the flip-chip joint and the bonding face with the metal plate 4, and the entire surface of the metal plate 4 other than the bonding face with the semiconductor element 2 are sealed with sealing resin 3 of the same material. The semiconductor element 2 can be sealed with the sealing resin 3 having no interface. Heat generated from the semiconductor element 2 can be transmitted to the metal plate 4 and dissipated from the wide surface of the metal plate 4 through the sealing resin 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
