| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of controlling the coating quantity and employing an electronic component binder having moisture absorbing properties. SOLUTION: In a semiconductor device comprising a package body 100, a recess 101 or a hollow section of the package body 100, a solid state image sensor 102, a die bond agent 103 for bonding the solid state image sensor 102 to the bottom face of the recess 101 thus preventing humidity in the recess 101 from increasing, a lead 104 consisting of an inner lead 104a and an outer lead 104b, a gold wire 105 connecting the inner lead 104a and an electrode on the major surface of the solid state image sensor 102, a sealing agent 106 for sealing the solid state image sensor 102 hermetically, and a translucent part 107 for protecting the solid state image sensor 102 and transmitting external light, the die bond agent 103 contains a moisture absorbing filler having a mean particle diameter of 15μm or less and has viscosity at 25°C of 7-20 P.s. COPYRIGHT: (C)2005,JPO&NCIPI
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