| 摘要 |
PROBLEM TO BE SOLVED: To provide a very low structure of a piezoelectric oscillator, and an inexpensive and high-quality production method. SOLUTION: In the structure of the piezoelectric oscillator wherein only a piezoelectric vibrator 2 and a face-down bonding type semiconductor chip constituting at least an amplifier circuit for oscillation are packaged on an upper surface of a wiring board 1 and an external terminal electrode 12 is provided on a lower surface of the wiring board 1, the wiring board 1 includes a recess for internally housing the piezoelectric vibrator 2 in a portion on an upper surface of a plate-like insulating substrate, the recess is air-tightly sealed with a lid, and the semiconductor chip is packaged in a position adjacent to the recess on the wiring board 1. Then, the semiconductor chip and an exciting electrode of the piezoelectric vibrator 2 are, and the semiconductor chip and the external terminal electrode 12 are conducted by wiring provided on an inner layer or a top layer of the wiring board 1. COPYRIGHT: (C)2005,JPO&NCIPI
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