| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for laminating a flexible printed circuit board, having a good peeling adhesive strength even at such a low temperature as -25°C and being suppressed of a flow-out volume at pressing operation, and to provide an adhesive film. SOLUTION: The adhesive film for laminating a flexible printed circuit board is prepared by laminating the adhesive composition for laminating a flexible printed circuit board, an adhesive film layer using the adhesive composition and a release paper. Wherein the adhesive composition is composed essentially of (A) an acrylic rubber comprising a carboxylic acid as a functional group, (B) a silane-modified epoxy resin obtained by alcohol elimination reacting (b1) a bisphenol-A type epoxy resin with (b2) a hydrolyzable alkoxysilane, (C) an epoxy group-having synthetic rubber, (D) a phenol resin and (E) a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI
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