发明名称 SMALL DIAMETER DRILL FOR PROCESSING PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a small diameter drill for processing a printed circuit board for maintaining hole position accuracy and a hole inner wall grade of many processing holes by improving abrasion resistance and welding resistance. SOLUTION: This small diameter drill for processing the printed circuit board has a hard film in at least a part of a base material surface. A tip part of the base material is formed of cemented carbide. The hard film is composed of one or more layers composed of a compound selected from nitride, carbide, and carbonitride of periodic table IVa, Va, VIa group metal. The layers composed of the compound has a layer including chlorine. A blade diameter is set toϕ0.01 mm to 3.0 mm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004322226(A) 申请公布日期 2004.11.18
申请号 JP20030116371 申请日期 2003.04.21
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SETOYAMA MAKOTO;OMORI NAOYA;FUKUI HARUYO;HIROSE KAZUHIRO;OKADA YOSHIO
分类号 B23B51/00;C23C16/34;C23C16/36;(IPC1-7):B23B51/00 主分类号 B23B51/00
代理机构 代理人
主权项
地址