| 摘要 |
A sensor chip (100) includes comb-toothed movable electrodes (24) displaceable in a Y-direction, and comb-toothed stationary electrodes (30, 31, 40, 41) arranged to confront those movable electrodes (24), on one face side of a semiconductor substrate (10). The sensor chip (100) detects acceleration on the basis of a capacity change accompanying an acceleration application in the Y-direction between the movable electrodes (24) and the stationary electrodes (30, 31, 41, 42). The stationary electrodes (30, 31, 41, 42) are individually disposed to confront each other on one and other sides of the direction taken along the Y-direction in the individual movable electrodes (24). The individual electrode pads (25a, 30a, 31a, 40a, 41a) and the circuit chip (200) are electrically connected by bump electrodes (300) so that one face of the substrate (10) confronts the circuit chip (200).
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