CHEMICAL MECHANICAL ABRASIVE KIT AND CHEMICAL MECHANICAL GRINDING METHOD THEREOF COMPOSED OF AQUEOUS-BASED COMPOSITION

摘要

PURPOSE: A grinding method and an abrasive are provided to prevent the expansion of a dishing at an over-grinding and the corrosion of a wiring portion and to improve the yield rate. CONSTITUTION: After grinding with an aqueous-based dispersion for a chemical mechanical grinding containing an abrasive grain, a chemical mechanical grinding is performed by using another aqueous-based composition containing more than one heterocyclic organic composition together. A chemical mechanical abrasive kit is composed of the aqueous-based dispersion for chemical mechanical grinding and the aqueous-based composition for chemical mechanical grinding. Thereby, the yield rate is improved by preventing the expansion of a dishing and the corrosion of a wiring portion.