| 摘要 |
PURPOSE: A leadframe for a BGA(ball grid array) is provided to eliminate the difficulty of a process and improve reliability by remarkably preventing a bump from being non-exposed in a process for molding a leadframe package. CONSTITUTION: A tie bar(33) whose both end parts are supported by a dam bar(31a,31b,31c,31d) is extended from the center of a leadframe. At least one isolation lead(37) distributes the pressure of molding resin induced in a molding process, installed in the periphery of the tie bar. The isolation lead is extended from the dam bar toward the inside of the leadframe, installed at both sides of the tie bar.
|
