发明名称 |
Multi-level integrated circuit for wide-gap substrate bonding |
摘要 |
An integrated circuit (30) includes a substrate (10) having an etched surface and a non-etched surface. The etched surface contains circuit elements (22, 24) and the non-etched surface contains a bonding surface (18). The non-etched surface is located at a predetermined height (12) from the etched surface. Bonding this integrated circuit (30) with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed. <IMAGE> |
申请公布号 |
EP1266863(A3) |
申请公布日期 |
2004.11.17 |
申请号 |
EP20020253722 |
申请日期 |
2002.05.28 |
申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
REGAN, MICHAEL J.;LIEBESKIND, JOHN;HALUZAK, CHARLES C. |
分类号 |
H01L21/60;B81B7/00;B81C1/00;H01L25/00;(IPC1-7):B81B7/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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