| 发明名称 |
PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES |
| 摘要 |
A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire is connected to a pad on an IC die, and a distal end of each ribbon wire forms a device lead. The die and the ribbon wires are encapsulated in a molding compound with a side of each device lead exposed. Such devices can be assembled without using lead frames. The omission of lead frames and the use of ribbon wires enable assembly of smaller devices having enhanced thermal dissipation capabilities. |
| 申请公布号 |
US2016190086(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514738937 |
申请日期 |
2015.06.15 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
XU LIQIANG;HE QINGCHUN;LIU PENG;ZHANG HANMIN |
| 分类号 |
H01L23/00;H01L23/31;H01L21/56;H01L23/495;H01L21/683;H01L23/367;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaged semiconductor device, comprising:
a die; a plurality of ribbon wires, wherein a proximal end of each ribbon wire is connected to a pad of the die; and molding compound encapsulating the die and the plurality of ribbon wires, wherein a side of a distal end of each ribbon wire is exposed to form a device lead. |
| 地址 |
Austin TX US |
