INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES

摘要

Various examples are provided for interconnection structures for molded IC packages. In one example, among others, an IC package includes a substrate and an interposer. A plurality of conductive elements provide physical and electrical contact between a surface of the substrate and a surface of the interposer. A standoff element disposed between the surfaces of the substrate and interposer provides a minimum spacing between the surfaces of the substrate and interposer. In some implementations, a standoff element is disposed between an IC die disposed on the surface of the substrate and the surface of the interposer. In another example, a method includes coupling conductive elements to a surface of an interposer, attaching a standoff element, coupling the conductive elements to a surface of a substrate, and forming an embedded layer between the interposer and substrate. The standoff element defines a minimum gap between the interposer and the substrate.

主权项

1. An integrated circuit (IC) package, comprising:
a substrate including a first surface and a second surface opposite the first surface of the substrate; an interposer including a first surface and a second surface opposite the first surface of the interposer; a plurality of homogeneous solder balls disposed between the first surface of the substrate and the second surface of the interposer, the plurality of homogeneous solder balls providing physical and electrical contact between the substrate and the interposer; an IC die disposed on the first surface of the substrate; and a standoff element disposed between the IC die and the second surface of the interposer, the standoff element providing a predefined minimum spacing between the IC die and the second surface of the interposer.