发明名称 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 An electronic component includes a magnetic body having first and second end surfaces opposing each other and first and second side surfaces connected to the first and second end surfaces, and first and second internal coil patterns disposed in the magnetic body and including coil pattern portions having a spiral shape and lead portions connected to ends of the coil pattern portions and exposed to one surfaces of the magnetic body, respectively. The coil pattern portions are exposed to the first and second side surfaces, and first and second side parts are disposed on the first and second side surfaces. A manufacturing method therefore is presented.
申请公布号 US2016189849(A1) 申请公布日期 2016.06.30
申请号 US201514930440 申请日期 2015.11.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE Seung Kyu
分类号 H01F27/28;H01F41/10;H01F41/02;H01F41/04;H01F27/255;H01F27/29 主分类号 H01F27/28
代理机构 代理人
主权项 1. An electronic component comprising: a magnetic body having first and second end surfaces opposing each other and first and second side surfaces connected to the first and second end surfaces; and first and second internal coil patterns disposed in the magnetic body, and including coil pattern portions having a spiral shape and lead portions connected to ends of the coil pattern portions and exposed to one surfaces of the magnetic body, respectively, wherein the coil pattern portions are exposed to the first and second side surfaces; and first and second side parts covering at least portions of the first and second side surfaces.
地址 Suwon-Si KR