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发明名称
用于在引线模组封装中之倒装片之具有缝隙或沟槽的引线框架结构
摘要
所揭为一种半导体晶粒封装体。在一实施例中,该晶粒封装体包含一半导体晶粒具有一第一表面与一第二表面,及一引线框结构具有一晶粒安装区,及有多数的引线由该晶粒安装区伸出。该晶粒安装区包含一或多个孔隙。一成型材料会包围该引线框结构之晶粒安装区与半导体晶粒的至少一部份。该成型材料亦会注入该等孔隙中。
申请公布号
TW200425446
申请公布日期
2004.11.16
申请号
TW093109929
申请日期
2004.04.09
申请人
快捷半导体公司
发明人
约瑟 拉杰夫;吴宗麟
分类号
H01L23/48
主分类号
H01L23/48
代理机构
代理人
恽轶群;陈文郎
主权项
地址
美国
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