发明名称 |
Four-bar linkage wafer clamping mechanism |
摘要 |
The wafer clamping mechanism comprises a linkage mechanism and a wafer contact point coupled to the linkage mechanism. The linkage mechanism includes a four-bar linkage having: a first link having a first fixed pivot and a first floating pivot remote from the first fixed pivot; a second link having a second fixed pivot and a second floating pivot remote from the second fixed pivot; and a third link having a first coupling pivot rotatably coupled to the first floating pivot, and having a second coupling pivot rotatably coupled to the second floating pivot. In use motion of the linkage mechanism causes the wafer contact point to clamp a wafer.
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申请公布号 |
US6817640(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20010896056 |
申请日期 |
2001.06.28 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MENON VENUGOPAL;COX DAMON KEITH |
分类号 |
H01L21/687;(IPC1-7):B25J15/08 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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