发明名称 |
Grounding and thermal dissipation for integrated circuit packages |
摘要 |
In a microelectronic chip package for which grounding and thermal dissipation is desired, a cover is provided having an opening which is aligned with a contact on the substrate connected to ground potential. The cover is connected to the electronic device and the ground contact. This invention provides for a method and electronic package to overcome the difficulties encountered when attempting to simultaneously attach a cover to two different surfaces with two different adhesives.
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申请公布号 |
US6819566(B1) |
申请公布日期 |
2004.11.16 |
申请号 |
US20030605752 |
申请日期 |
2003.10.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANOVITCH DAVID;DUCHESNE ERIC |
分类号 |
H01L23/31;H01L23/36;H01L23/552;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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