发明名称 |
Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls |
摘要 |
A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment. |
申请公布号 |
US6818541(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20030249572 |
申请日期 |
2003.04.21 |
申请人 |
COMCHIP TECHNOLOGY CO., LTD. |
发明人 |
YANG CHENG-CHIEH;CHEN WEN-LONG;TSAI YAO-HUANG;HU CHIH-LIANG;CHEN PAN-NAN |
分类号 |
H01L21/44;H01L21/60;H01L23/48;H01L23/485;H01L23/488;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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