发明名称 PROBER SYSTEM FOR IMPROVING ALIGNMENT CONTROL OF NEEDLE AND ALIGNING METHOD THEREOF BY USING SHAPE MEMORY ALLOY AND TEMPERATURE CONTROLLER
摘要 PURPOSE: A prober system for improving an alignment control of a needle and an aligning method thereof are provided to correctly rapidly and correctly the needle regardless of increment of needles by using a shape memory alloy and a temperature controller. CONSTITUTION: A wafer chuck(23) is used for supporting and fixing a wafer. A prober card(21) includes a needle which is formed with a shape memory alloy. The needle is in contact with a pad of the wafer in order to detect an electrical characteristic of a chip. A heating unit heats the needle to the shape memory temperature. The heating unit is formed with a heating fan for generating hot wind. The needle is formed with the shape memory alloy including nickel.
申请公布号 KR20040096300(A) 申请公布日期 2004.11.16
申请号 KR20030029202 申请日期 2003.05.09
申请人 DONGBUANAM SEMICONDUCTOR INC. 发明人 KIM, U SEON
分类号 H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/66
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