| 摘要 |
An alignment mark which is employed for the alignment of a semiconductor substrate during a lithography process in the production of a semiconductor element, includes a trough-like pattern having a width roughly equal to the width of a circuit element provided at the surface of the semiconductor substrate. Since the width of the trough-like pattern is set roughly equal to that of the circuit element, a secure trough-like pattern that will not be removed to an excessive degree during processes such as etch-back is formed at the surface of the semiconductor substrate, even if the alignment mark is formed concurrently with the formation of the circuit element. Consequently, a clear alignment mark that can be produced concurrently with the formation of a circuit element of the semiconductor circuit element and that presents no risk of collapsing or separating, is provided. |
