发明名称 WAFER LIFT APPARATUS TO PREVENT BENDING OF LIFT PLATE
摘要 PURPOSE: A wafer lift apparatus is provided to prevent a bending phenomenon of a lift plate due to support pins by improving a structure of the lift plate. CONSTITUTION: A wafer lift apparatus includes a lift actuator, a lift shaft, a lift plate, and a plurality of wafer support pins. The lift actuator(112) is formed with an air cylinder. The lift shaft(114) is elevated by the lift actuator. The lift plate(116) is installed horizontally to an end of the lift shaft. The wafer support pins are installed on an upper surface of the lift plate in order to support a wafer. The thickness of the lift plate is gradually reduced toward the end of the lift plate in order to minimize a load applied to the end of the lift shaft.
申请公布号 KR20040096152(A) 申请公布日期 2004.11.16
申请号 KR20030029003 申请日期 2003.05.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YEONG DO;OH, CHANG JONG
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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