发明名称 |
Exposed lead QFP package fabricated through the use of a partial saw process |
摘要 |
A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package body. Those leads exposed within the bottom surface of the package body are created through the utilization of a standard leadframe with additional lead features that are electrically isolated subsequent to a molding process through the use of a partial saw method.
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申请公布号 |
US6818973(B1) |
申请公布日期 |
2004.11.16 |
申请号 |
US20020237293 |
申请日期 |
2002.09.09 |
申请人 |
AMKOR TECHNOLOGY, INC. |
发明人 |
FOSTER DONALD C. |
分类号 |
H01L23/31;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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