发明名称 |
BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier |
摘要 |
In a BGA type semiconductor device wherein, while leaving a via hole for a solder ball, an insulating film formed of a photosolder resist (PSR) is provided on a tape substrate on its side where a wiring pattern is provided, a groove portion is provided between a bonding wire sealing portion and the via hole for a solder ball. The groove portion is a smaller-thickness portion of the insulating film provided as a part of the insulating film. By virtue of this construction, at the time of sealing of a wire bonding connection with a mold resin, the flow of the mold resin into the via hole for a solder ball can be prevented.
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申请公布号 |
US6818989(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20010000791 |
申请日期 |
2001.12.04 |
申请人 |
HITACHI CABLE, LTD. |
发明人 |
HIGUCHI AKIFUMI;KOIZUMI TOYOHARU;ASHIZUKA NORIHIRO |
分类号 |
H01L23/12;H01L21/60;H01L23/13;H01L23/31;H01L23/498;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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