发明名称 Method of mounting a component in an edge-plated hole formed in a printed circuit board
摘要 A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.
申请公布号 US6818477(B2) 申请公布日期 2004.11.16
申请号 US20020217726 申请日期 2002.08.13
申请人 POWERWAVE TECHNOLOGIES, INC. 发明人 VEITSCHEGGER WILLIAM K.;SAUER SCOTT
分类号 H05K1/02;H05K1/18;H05K3/00;H05K3/34;H05K3/42;(IPC1-7):H01L21/58 主分类号 H05K1/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利