发明名称 |
Method of mounting a component in an edge-plated hole formed in a printed circuit board |
摘要 |
A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board manufactured by a method including forming a hole through the top circuitry layer and the bottom layer, attaching the bottom layer to a pallet, placing the component in the hole, and soldering the component to the top circuitry layer and to the pallet.
|
申请公布号 |
US6818477(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20020217726 |
申请日期 |
2002.08.13 |
申请人 |
POWERWAVE TECHNOLOGIES, INC. |
发明人 |
VEITSCHEGGER WILLIAM K.;SAUER SCOTT |
分类号 |
H05K1/02;H05K1/18;H05K3/00;H05K3/34;H05K3/42;(IPC1-7):H01L21/58 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|