| 摘要 |
<p>PURPOSE: Provided are a heat conductive epoxy resin molded product which is improved in thermal conductivity and is useful as a heat insulating and electrical insulating material for an electronic component and its preparation method. CONSTITUTION: The heat conductive epoxy resin molded product comprises an epoxy resin having a molecular chain containing an azomethine group (-CH=N-) as a main component, and has a thermal conductivity of 0.5-30 W/m·K. Preferably the molecular chain of the epoxy resin contains a mesogenic group containing an azomethine group. Preferably the molecular chain of the epoxy resin contains at least one selected from the group consisting of mesogenic groups containing an azomethine group represented by the formulas 1, 2, 3 and 4, wherein X is R, F, Cl, Br, I, CN or NO2; n is an integer of 0-4; and R is an aliphatic hydrocarbon group.</p> |
