发明名称 |
Insert-moldable heat spreader, semiconductor device using same, and method for manufacturing such semiconductor device |
摘要 |
A heat spreader adapted to be insert-molded with resin on a surface of a circuit board on which a semiconductor chip is mounted so that the heat spreader covers the surface of the circuit board including an upper surface of the semiconductor chip over substantially a same area as that covered with molded resin when insert-molded with resin. The heat spreader has a main-portion which defines a larger gap with respect to the surface of the circuit board when insert-molded with resin and a sub-portion which defines a smaller gap with respect to the surface of the circuit board when insert-molded with resin. The sub-portion is embedded in the mold resin when insert-molded with resin so that the heat spreader is strongly adhered to the resin.
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申请公布号 |
US6818476(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20020079864 |
申请日期 |
2002.02.21 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD |
发明人 |
YONEMOCHI MASAHIRO |
分类号 |
H01L23/29;H01L21/56;H01L23/36;H01L23/433;(IPC1-7):H01L21/42;H01L21/48;H01L21/50 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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