发明名称 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader |
摘要 |
An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.
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申请公布号 |
US6817091(B2) |
申请公布日期 |
2004.11.16 |
申请号 |
US20020200807 |
申请日期 |
2002.07.22 |
申请人 |
INTEL CORPORATION |
发明人 |
FITZGERALD THOMAS J.;DEPPISCH CARL L.;HUA FAY |
分类号 |
H01L23/367;H05K7/20;(IPC1-7):H05K3/34 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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